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Microsystems, Electronics and Acoustics
ISSN 2523-4447 · e‑ISSN 2523-4455 Open Access · CC BY-SA 4.0
Vol. 24 · Issue 2 · 2019 Apr 30, 2019 Microsystems and Physical Electronics

Modeling of Multifunctional Thermoresistive Transduser Used Heat Exchange Technology

SO
Sergey M. Osinov Corresponding Національний технічний університет України "Київський політехнічний інститут імені Ігоря Сікорського" Ukraine
VZ
Viktor Fedorovich Zavorotnyi Національний технічний університет України "Київський політехнічний інститут імені Ігоря Сікорського" Ukraine
BL
Boris Ivanovych Lupyna Національний технічний університет України "Київський політехнічний інститут імені Ігоря Сікорського" Ukraine
OB
Olexandr Vasylovych Borisov Національний технічний університет України "Київський політехнічний інститут імені Ігоря Сікорського" Ukraine
Pages33-41 PublishedApr 30, 2019
VOL 24 · ISS 2 · 2019 View issue

Abstract

The physical and technical characteristics, structural and topological aspects of the micromechanical thermo-resistor active heating transdusers synthesis for fluid (gas and liquid) parameters determination are considered. All transducers are based on a single MEMS (Micro Electro Mechanical System) structure and differ in functionality due to different operating modes and different principles for determining fluid parameters. It allows the development of multifunctional sensors based on a single hardware, which includes a typical MEMS structure and mass production microprocessor, for example, PSoC (Programmable System On Chip). The transducers mathematical models acceptable for the COMSOL simulation library and designing of information electronics devices with the registration of various physical parameters are proposed. The analytical calculations on the basis of the proposed models for a gas flow sensor of the temperature dependence from the fluid flow velocity in the MEMS structure was performed. The proposed models can be used for the operation analytical description and computing of devices based on the use of thermoelectric processes in micro-scale structures. Ref. 29, fig. 3.

Keywords

References

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