Thermal fatigue prediction of viscoplastic solder for microelectronic components and systems

Abstract

The paper describes the results of the simulation and analysis of thermal fatigue for a viscoplastic solder for thermally-draining electronic components. The results indicate the feasibility of further experiments using additional mathematical models to pre-allocate the characteristic features, and using more input data. This method of calculation will then be able to determine the limiting modes of operation and carry out the selection of components, taking into account the temperature dependence of their parameters, will reduce the possibility of emergency modes of operation of various devices. On a circuit board covered with a thin layer of copper, thermo-terminated electronic components with a wiring of a crystal of the type "Wire-bonded" are installed; a typical example is a PWM controller of the family VT35, soldered tin A ball-grid array (BGA), 60Sn-40Pb [8]. To date, the types of BGA enclosures, their geometric sizes, location and size of balls, and the size variations are well structured and standardized by the Joint Electronic Device Engineering Council (JEDEC). The IPC-7351A standard, "Generic Requirements for Surface Mount Land Pattern and Design Standard", established by the Association Associationing Electronics Industries, with the requirements of JEDEC standards, sets  the size. Testing by thermocycling is mostly required to check reliability at temperature changes (in automotive, aero space, industrial and other applications), the criterion for successful testing is obviously the compliance of the TEC (ther mal expansion coefficient) of the material and component. The larger the component size and the higher the number of connections between the component and the board, the greater the impact of the TEC individual components.  The device is in the thermal mode of operation with a cycle of power: 5 · 107 W/m3 for 4 hours with increased heat output and 1 · 107 W/m3 for 2 hours with reduced. Both microprocessors generate energy when they are turned on and when they are in wait. This generates heat throughout the research period. Switching between high and low power is not instantaneous, but takes a few minutes. In terms of cooling, the microelectronic components have always been seen as a critical link. Since the power of the component is repeatedly turned on and off, it is exposed to cyclic thermal load. Damage due to thermal fatigue is due to the cyclic nature of the change in voltage and the partial relaxation of the residual stress variables that arise when tem perature changes.

Keywords

References

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Copyright (c) 2019 Олексій Сергійович Яма, Дмитро Віталійович Чипегін (Автор)